TPCA Show –  Orbotech Pacific Ltd. is presenting, in Booth #J608 Hall 1F, the Company’s latest solutions aimed at helping bare PCB manufacturers expand their business opportunities.

Being introduced for the first time is the breakthrough Paragon™-Xpress 9 Laser Direct Imaging system developed specifically for mass production and Paragon™-Ultra 100 for Flip-Chip BGA and advanced Flip-Chip CSP manufacturing.

Also being launched is InCAM™, a new comprehensive, high-precision computer-aided manufacturing (CAM) system for HDI and IC substrates developed by Frontline PCB Solutions. Orbotech’s Ultra PerFix™ AOR system and Sprint™-8 inkjet legend printer will be demonstrated as well.

“Our customers are actively looking for ways to gain critical production advantages in order to succeed in today’s competitive environment“, said Mr. Richard Klapholz, President of Orbotech Pacific Ltd. “Orbotech’s new products for the HDI/RF-Flex mass production and IC substrates segments are the result of our continued efforts to develop solutions that enable them to achieve the greatest operational efficiencies, while at the same time provide the advanced technologies needed to keep pace with increasingly complex product requirements,”

Orbotech’s “Expand Your Business Opportunities” program features solutions for PCB manufacturers to achieve greater levels of productivity and performance. Highlighted are latest capabilities in Laser Direct Imaging (LDI), laser plotting, inkjet legend printing, Automated Optical Inspection (AOI), Automated Optical Repair (AOR) and CAM/Engineering for mainstream and high density interconnect (HDI) applications.

Utilizing Orbotech’s high performance systems, manufacturers can maximize market share by gaining major improvements in production flexibility and time-to-sample, minimize costs a result of significant scrap PCB and material savings, shorter production processes and simpler operation as well as extend their capabilities to advanced products by achieving the required pattern miniaturization, registration accuracy and traceability essential for producing premium-price panels.

About Paragon™-Xpress 9 Mass Production Digital Imaging

Designed for high speed throughput of up to 5,000 panels a day per in-line solution, Paragon-Xpress 9 is the Laser Direct Imaging (LDI) system for mass production digital imaging of HDI, Flex and Rigid-Flex applications. Combining Orbotech’s field-proven Large Scan Optics (LSO) technology with high registration accuracy, the automated Paragon-Xpress 9 improves yields and productivity to achieve unparalleled imaging results on the most advanced applications – faster and more cost-effectively than ever before.

About Paragon™-Ultra 100 for Flip-Chip BGA and Advanced Flip-Chip CSP Manufacturing

Flip-Chip BGA and Flip-Chip CSP manufacturing with Orbotech’s field-proven Laser Direct Imaging

(LDI) system increases accuracy and ensures higher yields. The Paragon-Ultra 100 is designed for

Flip-Chip applications in a Semi-Additive Process and in Modified versions of a Semi-Additive Process. Now manufacturers can gain all the benefits of Orbotech’s LDI and achieve the highest imaging quality with a simplified operation.

About Ultra PerFix™Automated Optical Repair (AOR) System

Ultra PerFix AOR is a fully automated optical repair solution for shorts and excess copper in fine-line and IC substrate production. For the first time ever, substrates that in the past had to be scrapped can now be automatically repaired and saved. Featuring Orbotech's breakthrough, patent-pending CLR Technology^TM, (Closed Loop Repair), Ultra PerFix employs advanced image acquisition and image processing combined with superior laser control. Ultra PerFix achieves highly accurate, repeatable and reliable results which are not possible with manual repair.

About Sprint™-8 Inkjet Legend Printer

With its unique UCI technology™ (UV Curing Integrated), Sprint-8 delivers the highest quality legend imaging with fast speed at the lowest cost of ink per print for all PCB applications. Sprint-8 printers deliver new innovations for inkjet legend imaging. With its high-performance print heads and electronics, Sprint-8 can image even the most challenging legend jobs efficiently and accurately. Sprint-8 operation is simple and easy, requiring only minimal training. Key benefits include significantly reduced cycle time, yield improvement with minimized handling requirements, and improved operational efficiencies – all while realizing major cost savings.

About InCAM™

InCAM^™ is a comprehensive, innovative CAM system for HDI and IC Packaging PCB manufacturers that combines editing and analysis with automatic design-for-manufacture optimization to perform high-precision CAM tooling, with maximum efficiency and speed - helping manufacturers achieve lasting profitability and a competitive edge. InCAM^™ supports yield growth by enabling operators to multi-task and run advanced processes in the background, using computer's multi-core CPUs capabilities. Cycle time is dramatically shortened as colleagues team up on jobs in a data-secure, collaborative environment. InCAM ^™delivers improved data integrity and fault indication by allowing interactive post processing on selected DFM results. In addition, InCAM^™ operators can enjoy a streamlined user interface and remarkably easy-to-use tools. In addition, backwards compatibility with Genesis 2000, for both data and automation, drives productivity even further.

About Orbotech Ltd.

Orbotech is principally engaged in the design, development, manufacture, marketing and service of yield-enhancing and production solutions for specialized applications in the supply chain of the electronics industry. Orbotech’s products include automated optical inspection (AOI), production and process control systems for printed circuit boards (PCBs) and AOI, test and repair systems for flat panel displays (FPDs). The Company also markets computer-aided manufacturing and engineering (CAM) solutions for PCB production. In addition, through its subsidiary, Orbograph Ltd., the Company develops and markets character recognition solutions to banks and other financial institutions, and has developed a proprietary technology for web-based, location-independent data entry for check processing and forms processing; and, through its subsidiaries, Orbotech Medical Denmark A/S and Orbotech Medical Solutions Ltd., is engaged in the research and development, manufacture and sale of specialized products for application in medical nuclear imaging. Of Orbotech’s employees, more than one quarter are scientists and engineers, who integrate their multi-disciplinary knowledge, talents and skills to develop and provide sophisticated solutions and technologies designed to meet customers’ long-term needs. Orbotech maintains its headquarters and its primary research, development and manufacturing facilities in Israel, and more than 30 offices worldwide. Orbotech’s extensive network of marketing, sales and customer support teams throughout North America, Europe, the Pacific Rim, China and Japan deliver its knowledge and expertise directly to customers the world over. For more information visit www.orbotech.com.

Except for historical information, the matters discussed in this press release are forward-looking statements within the meaning of the U.S. Private Securities Litigation Reform Act of 1995. These statements relate to, among other things, future prospects, developments and business strategies and involve certain risks and uncertainties. The words “anticipate,” “believe,” “could,” “will,” “plan,” “expect” and “would” and similar terms and phrases, including references to assumptions, have been used in this press release to identify forward-looking statements. These forward-looking statements are made based on management’s expectations and beliefs concerning future events affecting Orbotech and are subject to uncertainties and factors relating to its operations and business environment, all of which are difficult to predict and many of which are beyond the Company’s control. Many factors could cause the actual results to differ materially from those projected, including cyclicality in the industries in which the Company operates, a sustained continuation or worsening of the worldwide economic slowdown, the timing and strength of product and service offerings by the Company and its competitors, changes in business or pricing strategies, changes in the prevailing political and regulatory framework in which the relevant parties operate or in economic or technological trends or conditions, including currency fluctuations, inflation and consumer confidence, on a global, regional or national basis and other risks detailed in the Company’s SEC reports, including the Company’s Annual Report on Form 20-F. The Company assumes no obligation to update the information in this press release to reflect new information, future events or otherwise, except as required by law.