With Orbotech's LSO Technology – yield improvement is achieved even on the most difficult jobs – including complex designs with fine features down to 25µm/1 mil.

Offering full compatibility with existing production processes, the systems are capable of imaging on any type of UV-sensitive media, including dry and liquid resists. They also feature dual resolution capabilities providing maximum flexibility for handling a wide range of jobs on the same system.

• Mass production digital imaging up to 5,000 panels/day per set (2 systems)
• Fully automated solutions for handling-free and clean environment
• High cost saving solutions offering the lowest imaging cost-per-panel
• Enables reduced yellow room floor space
• Full compatibility with existing processes
• Tight registration accuracy with dynamic imaging modes
• High depth-of-focus of ±300μm for single scan on Rigid-Flex
• Imaging on any type of UV-sensitive media including dry and liquid resists
• Imaging of inner or outer layers, SBU, Flex PCBs  
   
  

• 	Line Width Range
  Paragon™-Xpress 9	25 µm/1mil