The systems feature Orbotech’s patented LSO Technology™ which can image ultra-fine lines down to 12µm. For the FC-BGA/FC-CSP production our field proven system supports SAP and modified versions of SAP processes, while ensuring pitch down to 30µm. For advanced BGA/CSP subtractive production, our system provides throughput of up to 90 prints per hour.

Most of the IC Substrates manufacturers are already using Orbotech LDI systems to meet their advanced FC-BGA/FC-CSP and BGA/CSP board production needs, to achieve higher yields that significantly lower their bottom-lines costs, while increasing their ROI.