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+ IC Substrates ≥12 µm
+ HDI/Flex & RF ≥25 µm
+ QTA & Sampling ≥25µm
+ Solder Mask
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Solder Mask
LDI Systems with LSO Technology™ for Imaging Solder Mask Layers
Orbotech's field-proven Paragon systems feature state-of-the-art capabilities, achieving new levels of powerful LDI performance for high accuracy and fast throughput imaging of solder mask layers. Using LSO (Large Scan Optics) Technology – yield improvement is achieved even on the most difficult jobs of QTA & Sampling as well as HDI & Rigid-Flex/Flex applications.

Offering full compatibility with existing production processes, the systems are capable of imaging on a verity of solder resist types. With Paragon-SM 20, manufacturers can reach superior registration accuracy of ±12μm for imaging tighter annular rings and improves their yields.

  • Superior registration accuracy with dynamic imaging modes
  • High throughput solution
  • Highly flexible, maskless digital imaging increases image quality and production yield
  • The shortest time-to-market
  • Special vacuum control eliminates solder mask damage
  • High depth-of-focus of ±300μm for single scan on any distorted PCB topography
  • Simple operation
 
Line Width Range
Paragon™- SM 20
25µm/1mil
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